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            新聞中心

            EEPW首頁 > 消費電子 > 學習方法與實踐 > 電子知識寶典:China RoHS常用縮略術(shù)語

            電子知識寶典:China RoHS常用縮略術(shù)語

            ——
            作者:China RoHS 時間:2007-10-11 來源:RFID射頻快報 收藏

              縮略術(shù)語

                AQSIQ國家質(zhì)量監(jiān)督檢驗檢疫總局

                CCC強制認證

                EEE電氣設備

                EFUP環(huán)保使用期限

                EU歐盟

                EUCTP歐盟貿(mào)易項目

                FAQ’s常見問題

                GAC中華人民共和國海關總署

                IEC國際電工委員會

                Kitemark英國標準協(xié)會認證方案(自主)

                MCV最高濃度值

                MII中華人民共和國信息產(chǎn)業(yè)部

                MOC中華人民共和國商業(yè)部

                NDRC國家發(fā)展和改革委員會

                NWML國家重量和測量實驗室

                PRC中華人民共和國

                限制(在電氣產(chǎn)品中)使用有害物質(zhì)的指令

                SAIC國家工商總局

                SEPA國家環(huán)境保護總局

                WEEE廢電氣設備指令

                AcronymDefinitionMeaning

                AASAtomicabsorptionspectroscopy

                ABSAcrylonitrilebutadienestyrene

                ASOAg/Sn/O2SilverTinOxide

                AgSnO2Ag/Sn/O2Silvertinoxide

                AgSilverChemicalSymbol

                BGABallGridArray

                BiBismuthChemicalSymbol

                CAFConductiveanodicfilament

                CdCadmiumChemicalSymbol

                Cr(VI)HexavalentChromiumChemicalSymbol

                CRTCathoderaytube

                CSPChipScalePackage

                DEFRADepartmentoftheEnvironment,Food&RuralAffairsUKGovernmentenvironmentministry

                DTIDepartmentofTrade&IndustryKeyUKgovernmentdepartmentinvolvedincompliancepromotion

              ECEuropeanCommission

                ED-XRFEnergydispersiveX-Rayfluorescenceanalysis

                EEEElectricalandelectronicequipment

                ELVEndofLiveVehiclesEUDirective

                ESHEnvironmentalSafety&Health

                FR4AmaterialusedasasubstrateforaPCB,madeoffibreglass&epoxy

                FTIRFouriertransforminfra-red(spectroscopy)

                GCMSGaschromatographymassspectroscopy

                HASLHotAirSolderLeveling

                HgMercuryChemicalSymbol

                HPLCHighperformanceliquidchromatography

                ICIntegratedcircuitorionchromatographydependingoncontext

                ICPInductivelycoupledplasmaspectroscopy

                ITInformationTechnology

                LFSLeadFreeSoldering

                m.pt.Meltingpoint

                MCVMaximumConcentrationValue

                MLCCMultilayerceramiccapacitors

                MSLMoisturesensitivitylevel

                NiAuNickel/Gold

                OEMOriginalequipmentmanufacturer

                PbLeadChemicalSymbol

                PBBPolybrominatedBiphenylsFlameretardantchemical

                PBDEPolybrominatedDiphenylEtherFlameretardantchemical

                PCBPrintedCircuitBoard

                PVCPolyvinylchloride

                QAQualityassurance

                RestrictionoftheuseofcertainhazardoussubstancesEUDirective

                SABSn/Ag/BiTinSilverBismuthalloy

                SABCSn/Ag/Bi/CuTinSilverBismuthCopperalloy

                SACSn/Ag/CuTinSilverCopperalloy

                SAC305Sn/Ag3.0%/0.5%CuAlloymixpercentiles

                SAC385Sn/Ag3.8%/0.5%CuAlloymixpercentiles

                SAC408Sn/Ag4%/0.8%CuAlloymixpercentiles

                SEM/EDXScanningelectronmicroscope/energydispersiveX-rayanalysis

                SMESmallandmediumsizedenterprises

                SnTinChemicalSymbol

                TACAdaptionCommitteeEUTechnicalCommittee

                TCEThermalcoefficientofexpansion

                TCFTechnicalcompliancefile

                TgGlasstransitiontemperature

                VOCVolatileOctaneCompound

                WD-XRFWavelengthdispersiveX-Rayfluorescenceanalysis

                WEEEWasteelectricalandelectronicequipmentEUDirective

             



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