These packages are WCSPs (Wafer level Chip Scale Packages) of almost the same size as the chip, and at 1.4 mm × 0.9 mm × 0.5 mm (max.), offer an approximately 70% reduction in mounting area compared with Renesas Technology’s previous 5-pin standard logic IC packages (Renesas Technology package code: CMPAK-5).

The two companies will ensure a stable supply to the market by respective development of high-speed, low-voltage standard logic ICs using these packages with an alternative source partnership.

As initial NanoFree™ products in Renesas Technology, we have developed the HD74LVC1G Series of high-speed, low-voltage Unilogic ICs sharing the specifications of TI’s SN74LVC1G Series high-speed, low-voltage logic IC NanoFree™ products. Initially, sample shipments of two models, the HD74LVC1G04 and HD74LVC1G97, will begin in Japan in June 2003.

“Unilogic IC” is Renesas Technology’s name for a small-unit standard logic IC incorporating from single to triple gates in a single package. These Unilogic ICs simplify wiring and enable circuit modifications due to design changes to be implemented speedily.