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            EEPW首頁(yè) > 嵌入式系統(tǒng) > 設(shè)計(jì)應(yīng)用 > Quicklogic ArcticLink可編程連接平臺(tái)設(shè)計(jì)方案

            Quicklogic ArcticLink可編程連接平臺(tái)設(shè)計(jì)方案

            作者: 時(shí)間:2010-05-07 來(lái)源:網(wǎng)絡(luò) 收藏

            解決采用0.18um六層金屬CMOS工藝制造,內(nèi)核電壓為1.8V,I/O電壓可設(shè)定為1.8V,2.5V和3.3V. 的邏輯單元為640個(gè),集成了高速USB 2.0 OTG控制器, SD/SDIO/MMC/CE-ATA主控制器, ASSP/FPGA接口,以及靈活的架構(gòu),I/O,非常低功耗模式和安全鏈接.本文介紹了主要特性, 解決方框圖, 解決方框圖,以及各種USBOTG框圖,在汽車(chē)內(nèi)裝藍(lán)牙免提,智能手機(jī),PND/PMP和ePOS的應(yīng)用框圖.

            The QuickLogic ArcticLink Solution Platform is fabricated on a 0.18 μm, six layer metal CMOS process. The core voltage is 1.8 V. The I/O voltage input tolerance and output drive can be set as 1.8 V, 2.5 V, and 3.3 V.

            ArcticLink 器件亮點(diǎn):

            Hi-Speed USB 2.0 OTG Controller

            Single port OTG with embedded high-speed PHY

            Optional 12-signal ULPI interface

            Full-speed CEA-936-A mini-USB analog carkit interface

            Dedicated DMA controller

            High-speed up to 480 Mbits/sec.

            SD/SDIO/MMC/CE-ATA Host Controller

            SD/SDIO 1-bit or 4-bit up to 52 MHz with Secure Digital High Capacity (SDHC) support

            CE-ATA 1-bit, 4-bit or 8-bit up to 52 MHz

            MMC 1-bit, 4-bit or 8-bit up to 52 MHz

            High-speed and flexible to support multiple storage options and SDIO peripherals

            ASSP/FPGA Interface

            8 Kbytes scratchpad memory

            Flexible Host interface for USB and SD/SDIO/MMC/CE-ATA ports

            DMA and power management functions

            Direct memory aperture for peripheral subsystems

            Flexible Programmable Fabric

            0.18 μm, six layer metal CMOS process

            1.8 V core voltage, 1.8/2.5/3.3 V drive capable I/Os

            36 Kbits of SRAM C seven dual-port 4-Kbit high performance SRAM blocks

            Embedded synchronous/asynchronous FIFO controllers

            One user configurable clock manager (CCM) (110-ball WLCSP and 196-ball TFBGA packages only)

            Up to 120 programmable I/Os available

            100,000 system gates

            Nonvolatile, instant-on

            IEEE 1149.1 boundary scan testing compliant

            Programmable I/O

            Bank programmable drive strength

            Bank programmable slew rate control

            Independent I/O banks capable of supporting multiple I/O standards in one device

            Native support for DDRIOs (196-ball package only)

            Bank programmable I/O standards: LVTTL, LVCMOS, and LVCMOS18

            Can be used for level shifter and I/O voltage translator

            Very Low Power (VLP) Mode

            The QuickLogic ArcticLink Solution Platform has a special VLP pin which can enable a low power sleep mode that significantly reduces the overall power consumption of the device by placing the device in standby.

            Enter/exit VLP mode from/to normal operation in less than 250 μs (typical)

            Security Links

            There are several security links to disable JTAG access to the device. Programming these optional links completely disables access to the device from the outside world and provides an extra level of design security not possible in SRAM-based FPGAs.

            JTAG

            QuickLogic ArcticLink Solution Platform supports IEEE 1149.1 boundary scan or post-manufacturing testability. External access to this feature can be completely disabled.

            ArcticLink QL1A100主要特性列表:


            圖1.ArcticLink 解決方案方框圖

            圖2.ArcticLink 連接解決方案方框圖


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